Test results of Problem 7 (CAD Contest 2002)
|
Case 1 |
Extra dice # |
|||||
|
Team |
Mask # |
Wafer # |
Cost |
CHIP_A |
CHIP_B |
CHIP_C |
|
A33 |
1 |
3 |
103 |
54 |
169 |
47 |
|
A34 |
1 |
3 |
103 |
50 |
166 |
162 |
|
A35 |
1 |
4 |
104 |
56 |
440 |
192 |
|
A36 |
1 |
2 |
102 |
7 |
193 |
86 |
|
A37 |
1 |
3 |
103 |
6 |
214 |
80 |
|
A40 |
Invalid output format |
|
|
|
||
|
A41 |
1 |
3 |
103 |
8 |
87 |
230 |
|
Case 2 |
Extra dice # |
||||||
|
Team |
Mask # |
Wafer # |
Cost |
CHIP_A |
CHIP_B |
CHIP_C |
CHIP_D |
|
A33 |
1 |
3 |
103 |
168 |
99 |
173 |
173 |
|
A34 |
1 |
2 |
102 |
202 |
138 |
208 |
209 |
|
A35 |
1 |
4 |
104 |
33 |
76 |
271 |
274 |
|
A36 |
1 |
2 |
102 |
67 |
132 |
74 |
76 |
|
A37 |
1 |
2 |
102 |
328 |
56 |
94 |
94 |
|
A40 |
Invalid output format |
||||||
|
A41 |
1 |
2 |
102 |
202 |
138 |
208 |
209 |
|
Case 3 |
Extra dice # |
|||||||
|
Team |
Mask # |
Wafe r# |
Cost |
CHIP_A |
CHIP_B |
CHIP_C |
CHIP_D |
CHIP_E |
|
A33 |
1 |
4 |
104 |
374 |
380 |
372 |
348 |
1398 |
|
A34 |
1 |
2 |
102 |
448 |
451 |
451 |
458 |
460 |
|
A35 |
1 |
4 |
104 |
231 |
348 |
122 |
248 |
1492 |
|
A36 |
1 |
1 |
101 |
161 |
28 |
25 |
19 |
26 |
|
A37 |
1 |
2 |
102 |
2 |
372 |
4 |
820 |
376 |
|
A40 |
Invalid output format |
|||||||
|
A41 |
1 |
2 |
102 |
266 |
269 |
270 |
668 |
274 |
|
Case 4 |
Extra dice # |
||||||||||
|
Team |
Mask # |
Wafer # |
Cost |
CHIP_A |
CHIP_B |
CHIP_C |
CHIP_D |
CHIP_E |
CHIP_F |
CHIP_G |
CHIP_H |
|
A33 |
1 |
4 |
104 |
136 |
128 |
142 |
142 |
436 |
428 |
141 |
136 |
|
A34 |
1 |
5 |
105 |
88 |
79 |
90 |
91 |
590 |
88 |
91 |
578 |
|
A35 |
1 |
4 |
104 |
236 |
31 |
653 |
43 |
42 |
39 |
44 |
45 |
|
A36 |
1 |
3 |
103 |
43 |
32 |
35 |
36 |
37 |
35 |
35 |
34 |
|
A37 |
1 |
4 |
104 |
348 |
82 |
92 |
92 |
94 |
92 |
92 |
94 |
|
A40 |
Invalid output format |
||||||||||
|
A41 |
1 |
3 |
103 |
80 |
75 |
330 |
85 |
326 |
80 |
84 |
800 |
|
Case 5 |
Extra dice# |
||||||||||||
|
Team |
Mask # |
Wafer # |
Cost |
CHIP_A |
CHIP_B |
CHIP_C |
CHIP_D |
CHIP_E |
CHIP_F |
CHIP_G |
CHIP_H |
CHIP_I |
CHIP_J |
|
A33 |
1 |
8 |
108 |
358 |
264 |
171 |
732 |
269 |
1680 |
263 |
740 |
384 |
409 |
|
A34 |
1 |
7 |
107 |
640 |
355 |
1222 |
932 |
366 |
563 |
734 |
176 |
112 |
128 |
|
A35 |
1 |
9 |
109 |
113 |
130 |
491 |
137 |
905 |
257 |
359 |
141 |
142 |
279 |
|
A36 |
2 |
5 |
205 |
85 |
58 |
88 |
176 |
193 |
57 |
182 |
69 |
88 |
28 |
|
A37 |
1 |
9 |
109 |
390 |
414 |
133 |
294 |
109 |
172 |
294 |
2399 |
351 |
310 |
|
A40 |
Invalid output format |
||||||||||||
|
A41 |
1 |
5 |
105 |
193 |
18 |
495 |
96 |
945 |
20 |
95 |
96 |
16 |
1036 |
|
Case 6 |
Extra dice # |
|||||||||||||||
|
Team |
Mask# |
Wafer# |
Cost |
CHIP_A |
CHIP_B |
CHIP_C |
CHIP_D |
CHIP_E |
CHIP_F |
CHIP_G |
CHIP_H |
CHIP_I |
CHIP_J |
CHIP_K |
CHIP_L |
CHIP_M |
|
A33 |
1 |
20 |
120 |
43 |
827 |
88 |
86 |
50 |
575 |
106 |
436 |
958 |
216 |
106 |
118 |
118 |
|
A34 |
Chip placement exceed reticle size |
|||||||||||||||
|
A35 |
2 |
24 |
224 |
755 |
586 |
202 |
198 |
110 |
407 |
218 |
100 |
502 |
202 |
103 |
100 |
36 |
|
A36 |
3 |
7 |
307 |
64 |
70 |
44 |
48 |
83 |
98 |
40 |
468 |
55 |
60 |
461 |
54 |
478 |
|
A37 |
Core dump |
|||||||||||||||
|
A40 |
Invalid output format |
|||||||||||||||
|
A41 |
2 |
12 |
212 |
13 |
19 |
3844 |
214 |
41 |
170 |
34 |
139 |
137 |
138 |
39 |
139 |
-200 |
|
CPU Time (sec) |
||||||
|
Team |
Case 1 |
Case 2 |
Case 3 |
Case 4 |
Case 5 |
Case 6 |
|
A33 |
7.29 |
3.43 |
6.52 |
5.43 |
6.97 |
1.81 |
|
A34 |
0.05 |
0.09 |
0.18 |
0.45 |
0.91 |
N/A |
|
A35 |
1.86 |
1.58 |
2.72 |
1.9 |
9.75 |
1.62 |
|
A36 |
3.71 |
0.52 |
0.74 |
2.56 |
31.63 |
13.44 |
|
A37 |
132.72 |
0.29 |
71.59 |
269.5 |
635.1 |
N/A |
|
A40 |
N/A |
N/A |
N/A |
N/A |
N/A |
N/A |
|
A41 |
0.15 |
0.16 |
0.49 |
0.72 |
1.24 |
2.11 |
Note:
1. All test programs are tested three times for every test case. The best one among the three results is selected and shown in above tables.
2. A40 doesn’t report die saw data (diesaw.dat), and its other output formats are totally different from the requests. The results can not be evaluated.
3. A37 has core dump problem in case 6.
4. For A34 in case 6, the chip placement exceeds the limitation of reticle size defined in configuration file (mpw.cfg).
5. For A41 in case 6, no CHIP_M bare die is obtained.
6. Cost = 100 * (# of mask) + 1 * (# of wafer)
7. Extra dice = (# of obtained good bare dice) – (# of requested good bare dice).
8. From our point of view, the first priority of a test program is to lower the cost of mask and wafer as well as satisfying the requested number of bare dice. Extra dice is the secondary.