*Q1: (5/15, 2002)

關於"Chip Placement for Multiple Project Wafer" 這個題目，
在 Evaluation 項目中，有一項是 "The number of obtained bare dice"，
，請問所謂的 number of bare dice 指的是 required number 嗎 ? 或是
對每一個chip多出來的 number ? 還是所有多出來的 chip number ?
還是 所有得到的 chip number 呢 ? 有沒有說那一個特定的chip愈多
愈好呢 ? 謝謝。

*A1:

It means the total number of obtained bare dice

　

*Q2: (5/15, 2002)

在題目中，似乎沒有規定將reticle排入wafer的方法，
所以是否是我們自己決定呢？
如果是這樣的話，是否應該要在output file內註明我們的排法呢？

*A2:

In page 7 of the problem, we mentioned "the reference point (0,0) is at the center of the wafer". The authors don't need to specify the coordinates of reticle duplications on a wafer in an output file. However, the reticle duplications must start from the reference point as the example shown in Fig. 1.

　

*Q3: (5/15, 2002)

若一個baredie的四邊沒有被緊鄰的切到(如下圖)，亦即切下的baredie有多餘的區塊(如下圖的空白區塊)，請問這塊chipD是否可加入為有用的baredie個數？

*A3:

No, it is not a good bare die. A definition of good bare die is as follows:

A good bare die is obtained by cutting the four cut lines defined by the
four edges of the underlying chip and no other cut lines can cut across the
die.

　

*Q4: (5/15, 2002)

Reticle的width和height大小是否可改變，即題目所給的size若為max，那麼是不是可以自己往下調整size(小於max)？

*A4:

Yes, the meaning of “max” is clear enough.